JPH0536274Y2 - - Google Patents
Info
- Publication number
- JPH0536274Y2 JPH0536274Y2 JP1991029095U JP2909591U JPH0536274Y2 JP H0536274 Y2 JPH0536274 Y2 JP H0536274Y2 JP 1991029095 U JP1991029095 U JP 1991029095U JP 2909591 U JP2909591 U JP 2909591U JP H0536274 Y2 JPH0536274 Y2 JP H0536274Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- heat sink
- resin
- legs
- sealing body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 33
- 239000011347 resin Substances 0.000 claims description 33
- 238000007789 sealing Methods 0.000 claims description 16
- 230000035882 stress Effects 0.000 description 10
- 238000000465 moulding Methods 0.000 description 7
- 239000000843 powder Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991029095U JPH0536274Y2 (en]) | 1991-04-02 | 1991-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991029095U JPH0536274Y2 (en]) | 1991-04-02 | 1991-04-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0497351U JPH0497351U (en]) | 1992-08-24 |
| JPH0536274Y2 true JPH0536274Y2 (en]) | 1993-09-14 |
Family
ID=31764119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991029095U Expired - Lifetime JPH0536274Y2 (en]) | 1991-04-02 | 1991-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0536274Y2 (en]) |
-
1991
- 1991-04-02 JP JP1991029095U patent/JPH0536274Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0497351U (en]) | 1992-08-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4121185B2 (ja) | 電子回路装置 | |
| JPS634950B2 (en]) | ||
| JPH03108744A (ja) | 樹脂封止型半導体装置 | |
| JPH0536274Y2 (en]) | ||
| JPS62118555A (ja) | 集積回路パツケ−ジ | |
| JP2579222Y2 (ja) | 樹脂封止型回路装置 | |
| JPH046209Y2 (en]) | ||
| JPH03238852A (ja) | モールド型半導体集積回路 | |
| JP2003197828A (ja) | 樹脂封止型半導体装置 | |
| JPH03255655A (ja) | 半導体装置 | |
| JP2583242Y2 (ja) | 半導体装置 | |
| JPH11340377A (ja) | 表面実装型半導体装置 | |
| JPH04247645A (ja) | 金属基板の実装構造 | |
| KR930009035A (ko) | 접착리드를 이용한 반도체 패키지 구조 및 그 제조방법 | |
| JP2532400Y2 (ja) | ハイブリットｉｃ | |
| JPS6334277Y2 (en]) | ||
| US20060108681A1 (en) | Semiconductor component package | |
| JP2504262Y2 (ja) | 半導体モジュ―ル | |
| JPH066465Y2 (ja) | 混成集積回路の組立構造 | |
| JPH0533535B2 (en]) | ||
| JPH0380599A (ja) | 電子回路モジュール | |
| JPH02205056A (ja) | 集積回路パッケージ | |
| KR20070067382A (ko) | 반도체 패키지용 기판 | |
| JP2904175B2 (ja) | 集積回路装置の実装構造および集積回路実装用ケース | |
| JP2707899B2 (ja) | 混成集積回路装置 |